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Suitable for foldable AMOLED displays of the future
January 23, 2014
By: DAVID SAVASTANO
Editor, Ink World Magazine
The Centre for Process Innovation (CPI) has developed novel backplane fabrication processes to allow the bending of organic thin film transistors (OTFT) arrays to small radii (1 mm) without a significant reduction in device performance. The work undertaken demonstrates progress towards optimum organic semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes. In order to achieve the tight b...
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